Printed Wiring Board Technology Infusion and Supplier Capability Overview

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at QLF 2018 provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Printed Circuit Board Quality Assurance

PCB Assurance Summary: PCB assurance actives are informed by risk in context of the Project. Lessons are being applied across Projects for continuous improvements. Newer component technologies, smaller/high pitch devices: tighter and more demanding PCB designs: Identifying new research areas. New materials, designs, structures and test methods

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresse

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.

EFFECTS OF GLASS/EPOXY INTERPHASES ON ELECTRO-CHEMICAL FAILURES IN PRINTED CIRCUIT BOARDS

Reduction in printed circuit board line spacing and via diameters and the increased density of vias with higher aspect ratios (ratio between the thickness of the board and the size of the drilled hole before plating) are making electronic products increasingly more susceptible to material and manufacturing defects. One failure mechanism of particular concern is conductive anodic filament formation, which typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. The glass-resin bond degradation provides a path along which electrodeposition occurs due to electrochemical reactions. Once a path is formed, an aqueous layer, which enables the electrochemical reactions to take place, can develop through the adsorption, absorption, and capillary action of moisture at the resin/fiber interphase. This study describes the experimental and analytical work undertaken to understand the glass-resin delamination and the methods used for analyzing this critical interphase. This study shows that a smaller conductor spacing in reduces the time to failure due to conductive anodic filament formation and that the plated-through-hole to plated-through-hole conductor geometry is more susceptible to conductive anodic filament-induced failures than plated through hole to plane geometries. The results also show that laminates with similar materials and geometries with a 45-degree angle of weave demonstrate a higher resistance to conductive anodic filament formation compared with a 90-degree angle of weave. The study is the first of its kind conducted on FR-4 printed circuit board materials where the pathway formation due to breakage of the organosilane bonds at the glass/resin interphase was evaluated. Using techniques such as force spectroscopy, micro-Fourier transform infrared spectroscopy, scanning quantum interface device microscopy and focused ion beam, evidence of bond breakage and a pathway formation was revealed, poor glass treatment, hydrolysis of the silane glass finish (adsorption of water at the glass fiber/epoxy resin interphase) or repeated thermal cycling contribute to the bond breakage. The technique of applying in-situ resistance measurements during cross-sectioning analysis of printed circuit boards suspected of conductive anodic filament is the first time this method is described in the open literature. This solution addresses the potential problem in destructive physical analysis of grinding away the evidence of the CAF filament and ultimately loosing evidence at the failure site. By applying a subset of the evaluation criteria described in this research, an upfront evaluation of printed circuit board materials can be performed for susceptibility to electro-chemical migration and other failure causes in PCBs that are attributable to the glass/resin interfacial adhesion. Manufacturers can identify board suppliers based on answers to and validation of a series of questions. These questions focus on the necessary requirements of reliable board material manufacturing and are independent of the specifications of the product

Life Cycle Analysis of a SpaceCube Printed Circuit Board Assembly Using Physics of Failure Methodologies

In this reliability life cycle evaluation of the SpaceCube 2.0 processor card, a partially populated version of the card is being evaluated to determine its durability with respect to typical GSFC mission loads

Knowledge and awareness of orthopaedic surgeons about radiation hazards in operation theatres

Background: Due to increase in geriatric orthopaedic patients minimally invasive soft tissue and orthopaedic surgeries are gaining. But such procedures have increased the surgeon’s dependence on fluoroscopy which has exposed them to ever increasing dosage of ionising radiations (both direct and scattered).Methods: The study was carried out among medical professionals attending annual north zone conference of orthopaedics using a pre-designed questionnaire on a non-probability sample of 200 orthopedicians.  Questionnaires contained 11 MCQs.Results: 62% of the surgeons believed that hands receive maximum amount of C-arm radiations followed by thyroid (25%). 9% of surgeons have answered eyes and 4% say gonads. 31% of surgeons believe that 100 mSv is allowable annual effective whole-body dose of radiation. 15% believe it to be 500 msv. Majority (37%) of the surgeons had no idea on the allowable annual effective whole-body dose of radiation. 30% of surgeons believe that allowable annual effective dose of radiation for hands is 50 msv. Further 23% of the surgeons believe it to be 100 msv. 50% have no idea about this.Conclusions: All orthopaedic residents and surgeons should have more information and knowledge about ionising radiation. Special courses and workshops can be arranged at local, regional and national levels in this regard.